BUSBOARD® SMT Board, SOIC Footprints, (100x160mm) (SMT3U)

SMT3U is a prototyping circuit board for 0805, 1206, SOIC, SOT and other SMT parts. It has three SOIC-32 footprints, each routed to 32 pads. The SMT rectangle pads are spaced for 0805 and 1206 components. The SMT rectangle pads have 0.1" spacing to allow DIP ICs and headers to be attached. A through hole prototyping area for headers, power connections, and DIP ICs is provided. The BusBoard zig-zag circuit pattern on the through hole area allows easy access to both sides of headers and ICs. A solid ground plane on the back side provides an easy way to make ground connections and helps lower noise for RF and high speed logic circuits. Every second SMT rectangle pad has an unplated hole for easy connection to the ground plane on the back side - just insert a wire and solder both sides. Two power rails and four mounting holes are provided.